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Thermal cycle thermoelectric module series

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Thermal Cycling Thermoelectric Module series are specifically designed for temperature cycling applications. Thermal cycling exposes a Peltier cooler to demanding physical stresses as the module shifts from heating to cooling, and this can significantly reduce the operational life of a standard TEC. Optimized for thermal cycling, intensive testing has shown that Ferrotec’s 70-Series of thermal cycling TECs deliver significantly longer thermal cycling operational life. Typical applications that use these Peltier coolers include instrumentation, chillers, PCR devices, thermal cyclers, and analyzers.


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TThermal Cycling Thermoelectric Module series are specifically designed for temperature cycling applications. Thermal cycling exposes a Peltier cooler to demanding physical stresses as the module shifts from heating to cooling, and this can significantly reduce the operational life of a standard TEC. Optimized for thermal cycling, intensive testing has shown that Ferrotec’s 70-Series of thermal cycling TECs deliver significantly longer thermal cycling operational life. Typical applications that use these Peltier coolers include instrumentation, chillers, PCR devices, thermal cyclers, and analyzers.

Customized size is available.

*Our advantages


Relying on professional technical team and laboratory in Shenzhen, we provide the best solutions of thermoelectric module use. Each piece of our module is tested 3 times under advanced equipments. The reject ratio of our modules is under less than five in then thousand. Our products widely applied in medical equipment, optical communication, aerospace, automotive etc. We also have professional technical team which is focusing on expanding new application of thermoelectric modules. So your requirements can be satisfied properly.

*Specification selection


The heart of semiconductor refrigeration application products is semiconductor refrigeration sheet. According to the characteristics, weaknesses and application scope of semiconductor temperature difference, the following problems should be determined when selecting semiconductor refrigeration sheet:
1. Determine the working state of the semiconductor cooling sheet.
2. Determine the actual temperature of the hot end during refrigeration.
3. Determine the working environment and atmosphere of semiconductor refrigeration sheet.
4. Determine the working object and thermal load of semiconductor cooling sheet.
5. Determine the number of stages of the cooling sheet. The selection of the number of stages of the semiconductor cooling sheet must meet the requirements of the actual temperature difference, that is, the nominal temperature difference of the semiconductor cooling sheet must be higher than the actual temperature difference, otherwise it cannot meet the requirements, but the number of stages cannot be too many, because the price of the semiconductor cooling sheet increases greatly with the increase of the number of stages.
6. Specification of semiconductor cooling sheet. After selecting the number of stages of the semiconductor cooling sheet, the specification of the semiconductor cooling sheet, especially the working current of the semiconductor cooling sheet, can be selected. Because there are several kinds of semiconductor refrigeration sheets that can meet the temperature difference and produce cooling at the same time, but due to different working conditions, the stack with low working current is usually selected, because the cost of supporting power supply is small at this time. However, the total power of the stack is the decisive factor. If the same input electric power is reduced, the working current has to increase the voltage (0.1V for each pair of elements), so the number of elements has to increase.
7. Determine the number of semiconductor cooling sheets. This is determined according to the total cooling power of the stack that can meet the temperature difference requirements. It must ensure that the total cooling capacity of the stack at the working temperature is greater than the total power of the thermal load of the working object, otherwise it cannot meet the requirements. The thermal inertia of the stack is very small, not more than one minute under no-load. However, due to the inertia of the load (mainly due to the thermal capacity of the load), the actual working speed to reach the set temperature is much more than one minute, for several hours. If the working speed is higher, the number of stacks will be more. The total power of the thermal load is composed of the total heat capacity plus the heat leakage (the lower the temperature, the greater the heat leakage).


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