Thermal cooling system-Gas liquid thermoelectric cooling / heating unit

Short Description:

The system introduced here is Air to Liquid type thermoelectric cooling/heating unit with 170 watts cooling power where we use heat sink with fans for heat dissipating of thermoelectric modules to cool or heat up the circulated water or liquid. The unit is designed for cooling or heating circulated liquid purpose. It can cool 2 Liters of water from 25 ˚C down to 1 ˚C within one hour, and also can be used to heat up water up to 100 ˚C. Built up with our high performance TEHC series thermoelectric cooling modules, the unit demonstrates superior performance.   170 W thermoelectric cooling/heating unit runs on 24 VDC with 11 A current drawn. When the red wire is connected to positive and black to negative, it is in cooling mode, and if the polarity is reversed, then in heating mode.


Product Detail

Product Tags

The system introduced here is Air to Liquid type thermoelectric cooling/heating unit with 170 watts cooling power where we use heat sink with fans for heat dissipating of thermoelectric modules to cool or heat up the circulated water or liquid. The unit is designed for cooling or heating circulated liquid purpose. It can cool 2 Liters of water from 25 ˚C down to 1 ˚C within one hour, and also can be used to heat up water up to 100 ˚C. Built up with our high performance TEHC series thermoelectric cooling modules, the unit demonstrates superior performance.

170 W thermoelectric cooling/heating unit runs on 24 VDC with 11 A current drawn. When the red wire is connected to positive and black to negative, it is in cooling mode, and if the polarity is reversed, then in heating mode.

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*Our advantages


Relying on professional technical team and laboratory in Shenzhen, we provide the best solutions of thermoelectric module use. Each piece of our module is tested 3 times under advanced equipments. The reject ratio of our modules is under less than five in then thousand. Our products widely applied in medical equipment, optical communication, aerospace, automotive etc. We also have professional technical team which is focusing on expanding new application of thermoelectric modules. So your requirements can be satisfied properly.

*Use required reading


At first, the semiconductor refrigeration sheet was developed by the former Soviet Union's delayed construction of China's military projects. Its real name is semiconductor refrigeration sheet, not semiconductor refrigeration sheet. Because its "cause" is the same as "system", most people are used to calling it refrigeration sheet. It is called Peltier in English and thermoelectron chip by others, Referred to as Tec, it is mainly composed of p-type and n-type semiconductor chips, several crystal stacks are connected in series into chips, and then synthesized with metallized porcelain chips. At present, the main functions are cooling and heating (when electricity is used) and power generation (when temperature difference).
The cooling efficiency of semiconductor cooling sheet is very low, about 30% of the total power consumption. The heating rate is very large, about 130% of the total power consumption. Nevertheless, it still has many advantages, such as silence, fire and flame resistance, and can withstand a certain high temperature. Small size, vibration resistance and long service life. Therefore, it is widely used in various fields.
For beginning users, selecting the model is the first thing to do. To select the model, first determine the voltage that can be taken. For example, if it is DC 12V, you can select tec1-127 series semiconductor refrigeration tablets, and then determine the current. Generally, the higher the current power, but the more demanding the dispersion requirements are. Therefore, under the condition of meeting the refrigeration requirements, low-power semiconductor refrigeration chips, such as tec1-127024040, shall be used as much as possible. In this way, it is easy to do heat dissipation design and save electric energy.
Since the degree of cooling produced by semiconductor cooling fins is related to many factors, such as voltage, current, heat dissipation design, heat conductive silicone grease and ambient temperature, many experiments need to be done when developing products. When the parameter values of all parties reach an equilibrium value, the experiment is completed, and the first sample can be made for guidance in subsequent mass production.


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