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The Peltier coolers in Aurin High-Power Thermoelectric Module series

Short Description:

The Peltier coolers in Aurin High-Power Thermoelectric Module series are designed to maximize heat pumping capacity. These single-stage TECs enable increased cooling capacities and efficiencies in a standard thermoelectric cooler footprint. The high cooling density of these Peltier coolers enables high-performance heat exchangers in smaller, more efficient sizes.


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The Peltier coolers in Jing Ling High-Power Thermoelectric Module series are designed to maximize heat pumping capacity. These single-stage TECs enable increased cooling capacities and efficiencies in a standard thermoelectric cooler footprint. The high cooling density of these Peltier coolers enables high-performance heat exchangers in smaller, more efficient sizes.

Customized size is available.

type ImaxA △Tmax Vmax(Qc=Ow) Qcmax(T=0) couple L.B.H(mm)
TEC1-24106 6 72 33.1 108 241 55×54.2
TEC1-24108 8 72 33.1 153 241 55×54.0
TEC1-19910 10 72 27.4 148 199 40x40x3.4
TEC1-12712 12 72 17.5 114 127 40X40X3.4

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*Our advantages


Relying on professional technical team and laboratory in Shenzhen, we provide the best solutions of thermoelectric module use. Each piece of our module is tested 3 times under advanced equipments. The reject ratio of our modules is under less than five in then thousand. Our products widely applied in medical equipment, optical communication, aerospace, automotive etc. We also have professional technical team which is focusing on expanding new application of thermoelectric modules. So your requirements can be satisfied properly.

*Use required reading


Here are some misunderstandings and key points in the use of semiconductor cooling sheet, which are shared by colleagues of aoling cooling sheet technology department:
1. It is not that the higher the power and heat of the semiconductor cooling sheet, the better the cooling design of its own products, but when it can meet the thermal design requirements, the higher the power, the better the products. If it can meet the cooling requirements, try to choose a low-power semiconductor cooling sheet.
2. When assembling the semiconductor cooling sheet, the rigid locking structure shall not be adopted, but the flexible locking structure shall be adopted, such as the CPU radiator device of the computer.
3. After power on, the closer the heat sink temperature is to the ambient temperature (usually not greater than 3 ~ 5 ℃), the better the thermal design. The temperature of the cold end is low.
4. Thermal conductive silicone grease shall be of high thermal conductivity and good dry resistance.
5. Dew protection measures: as long as the cold parts are not lower than the bad environment temperature by about 5 ℃, they will not condense. If the cold parts cannot avoid being lower than the bad environment temperature by 5 ℃, they shall be sealed with vacuum cotton or thermal insulation materials to isolate them from the outside.


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